As a fully automatic baking equipment, it is applicable to the high-temperature aging test (stress relief) of lens units after assembly and the baking & curing of retainers or IR films after dispensing.
As a fully automatic baking equipment, it is applicable to the high-temperature aging test (stress relief) of lens units after assembly and the baking & curing of retainers or IR films after dispensing.
As a fully automatic baking equipment, it is applicable to the high-temperature aging test (stress relief) of lens units after assembly and the baking & curing of retainers or IR films after dispensing.
1.At high temperature, it is applied to test whether there is a softening, weakened performance,feature change, potential damage, or oxidation of the components. 2.At low temperature, it is applied to test whether there is a cracking, embrittlement, movable part jamming or feature change of the components.
applicable to the baking and curing after active alignment of camera modules used in automotive sector, security, smart home and other fields.
Applicable to the aging test of camera module in automotive sector, security, smart home and other fields.
It is applicable to the baking and curing after dispensing, coating, and potting in AI intelligence, 5G communication, 3C, consumer electronics, automotive electronics, and semiconductor fields.
It is applicable to the baking and curing after dispensing, coating, and potting in AI intelligence, 5G communication, 3C, consumer electronics, automotive electronics, and semiconductor fields.
It is applicable to the curing after dispensing,coating, and ink screen printing in Mini LED,oil printing and semiconductor fields.
It is applicable to the curing after dispensing,coating,and potting of automotive electronics and IGBT power semiconductor modules.
It is applicable to the curing of lengthened FPC and PCBA of products in new energy, automotive electronics, aerospace, and military fields.