

It is applicable to the curing after dispensing,coating,and potting of automotive electronics and IGBT power semiconductor modules.
Process Flow:
Transfer material from the front machine→manipulator of loading module transfers material to the preset layer →the liftable door of the preset layer opens→place the material into the baking chamber and the liftable door closes→liftable door of the layer opens after baking→manipulator of unloading module picks up and transfers material to the next machine
Product Feature:
1.Precise Temperature Control: multi-zone temperature control system monitors temperature fluctuations in real time and full-zone nitrogen inflation could be achieved; automatic temperature regulation of PID ensures a temperature control precision of ±1℃; 2.Stable Transfer: servo motor drives the robotic arm to pick up,transfer and unload material,free from sliding and rolling friction, ensuring "zero defects" on the product surface;
3.Excellent Sealing Performance: multi-zone nitrogen inflation structure effectively isolates the product from oxygen,ensures uniform distribution of heat and nitrogen,significantly reduces voids of products, and enhances curing effect consistency;automatic recirculation of jig; high degree of automation;
4.Compact Design: with the same production capacity, the footprint length of a vertical oven is two meters while the tunnel oven is ten meters, significantly saving plant space;with the same plant area,higher production capacity can be achieved by applying vertical ovens.
| Equipment Model | VCO-MR-N-20-01 | VCO-MR-N-20-01L |
| Applicable Product | Applicable to the Curing After Dispensing,Coating,and Potting of Automotive Electronics and IGBT Power Semiconductor Modules. | |
| Maximun Transfer Plate Size | L350*W260mm | L550*W450mm Adjustable |
| Loading& Unloading Method | Fully Automatic Loading & Unloading,Free From Manual Operation | |
| Width Adjustment | Automatic Width Adjustment | |
| Heating Method | Hot Air Heating | |
| Baking Temperature | Adjustable Room Temperature+15℃~200℃ | |
| Temperature Control Precision | ≤±1℃ | |
| Temperature Uniformity | ≤±2℃ | |
| Jig Breakaway Tab | 10mm (Customizable) | |
| Layer Qty | 20 Layers; Layer Spacing 60mm(Customizable) | |
| Product Flow Direction | Left-to-Right;Right-to-Left | |
| Motion Mode | Manipulator Pickup&Transfer&Placing;No Sliding or Rolling Friction;Free from Risks of Jamming or Dropping. | |
| Transfer Plate Height From Ground | Lifting Z-Axis at Chamber Entry&Exit; Adjustable HT 580mm~1780mm | |
| CT | >15S | |
| ppm | Static 200ppm,Dynamic 1000ppm | |
| MES | Optional | |
| Overall Dimension | L1750*W1300*H2100mm | L2200*W1500*H2100mm |
| Equipment Weight | 1800KG | 1850KG |
| Power Supply Requirement | TN-S AC380V/50HZ/60HZ | |
| Air Pressure Requirement | 0.6~0.8MPa | |
| Environment Temperature | 10~30℃ | |
| Environment Humidity | ≤80% No Condensation | |